Columbia University

Tingjun Chen Wins First Place in the ACM MobiCom 2019 Student Research Competition (SRC)


WiMNet lab Ph.D. student Tingjun Chen is the ACM MobiCom 2019 Student Research Competition (SRC) First Place Winner. ACM MobiCom is the flagship conference in the area of mobile computing and wireless networking, and this year’s conference was held in Oct. 21–25 at Los Cabos, Mexico. Tingjun will advance to the ACM SRC Grand Finals, where first place winners from various ACM Special Interest Groups (SIGs) are evaluated. The winners of the Grand Finals will be recognized at the Annual ACM Awards Banquet, the same banquet that also recognizes the Turing Award winners.

Tingjun ChenTingjun received the award in the graduate research category for his research project titled “Enabling wideband full-duplex via frequency-domain equalization”, which is joint work with EE students and alumni Mahmood Barrani Dastjerdi, Jackson Welles, Jin Zhou, and EE professors Harish Krishnaswamy and Gil Zussman. This work takes place within the Columbia FlexICoN project and focuses on the design and evaluation of wideband full-duplex radios grounded in integrated circuit (IC) implementations that are more suitable for small-form-factor devices. Tingjun also presented the full paper about this work at the MobiCom main conference as one of the 55 accepted papers out of 290 submissions (acceptance rate of 19.0%). The developed full-duplex radios were also recently integrated in the remotely-accessible city-scale NSF PAWR COSMOS testbed, thereby allowing the research community to experiment with full-duplex wireless.

Tingjun received his B.Eng. in electronic engineering from Tsinghua University, China, in 2014 and his M.S. in electrical engineering from Columbia in 2015. His research interests are in the areas of wireless networking and systems with a focus on emerging technologies including ultra-low-power communication and IoT, full-duplex and millimeter-wave wireless, and optical-wireless networks and edge cloud. He has received a number of awards, including the Facebook Fellowship, the Wei Family Private Foundation Fellowship, the Columbia Electrical Engineering Armstrong Memorial Award and Millman Award, the Columbia Engineering Oscar and Verna Byron Fellowship, as well as the ACM CoNEXT 2016 Best Paper Awardand the ACM MobiHoc 2019 Best Paper Finalist. In September 2018, he was one of 200 young researchers from around the world selected to attend the sixth Heidelberg Laureate Forum.

Tingjun Chen

Original story here.